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Low loss, high adhesion build-up film based on thermosetting blend of epoxy and maleimide resin

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Abstract

The development of advanced packaging technology has led to increasingly finner circuits, closer spacing, thinner insulating layers, smaller and denser drilling holes in printed electronic circuits. Traditional insulation materials, such as build-up dielectric films and electronic packaging substrates, face big challenges with high dielectric constant and dielectric loss, poor thermal stability, and weak adhesion to conductive layers. This study addresses these issues by developing suitable base resin formulations for build-up films through a detailed evaluations of chemical structures, thermal properties, dielectric performance, etc. with a blended system of epoxy resin and maleimide resin. After comprehensive considerations of thermodynamics, dielectric performance, and processabilities, a composite formulation for build-up dielectric films is determined. The developed build-up film with an epoxy resin to maleimide resin ratio of 8:2 exhibits a dielectric loss of 0.0030 and a dielectric constant of 3.146 at 10 GHz, with an adhesion strength to conductive layer 2.19 N/cm, and a DMA Tg 190.9 °C. Meanwhile, the build-up film can pass the stringent requirements of processes such as chemical copper plating, copper sinking, and electroplating.

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Funding

This work was supported by the National Natural Science Foundation of China (NSFC, No. 62374080), the Ministry of Industry and Information Technology of China, and Shenzhen Key Laboratory of Intelligent Manufacturing for Continuous Carbon Fibre Reinforced Composites (Project No. ZDSYS20220527171404011).

Author information

Authors and Affiliations

  1. Shenzhen Key Laboratory of Intelligent Manufacturing for Continuous Carbon Fiber Reinforced Composites, Southern University of Science and Technology, Shenzhen, 518055, China

    Ying Yi, Zeming Fang, Xiaotao Zhu, Zeru Wang & Ke Wang

  2. School of System Design and Intelligent Manufacturing, Southern University of Science and Technology, Shenzhen, 518055, China

    Ying Yi, Zeming Fang, Xiaotao Zhu, Zeru Wang & Ke Wang

  3. National Engineering Research Center of Electronic Circuits Base Materials, Shengyi Technology Co., Ltd, Dongguan, 523000, China

    Qianfa Liu, Zengbiao Huang, Junfan Chen & Qianping Rong

Contributions

All authors contributed to the study’s conception and design. Conceptualization, K.W., Q.F.L, Z.B.H; methodology, K.W., Q.F.L, Z.M.H, Q.P.R and Y.Y.; software, Y.Y., Z.M.F, and X.T.Z.; validation, Y.Y.; formal analysis, Y.Y.; investigation, Y.Y.; resources, Z.B.H., Q.P.R and K.W.; data curation, Y.Y., and J.F.C; writing—original draft preparation, Y.Y.; writing—review and editing, K.W., Z.M.F,, X.T.Z., Z.R.W. and Z.B.H.; visualization, Y.Y.; supervision, K.W.; project administration, K.W.; funding acquisition, Y.Y. All authors have read and approved the final manuscript.

Corresponding author

Correspondence to Ke Wang.

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Yi, Y., Fang, Z., Zhu, X. et al. Low loss, high adhesion build-up film based on thermosetting blend of epoxy and maleimide resin. J Mater Sci: Mater Electron 36, 1231 (2025). https://doi.org/10.1007/s10854-025-15269-x

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